Beneq TFS 200

ALD research equipment that grows with you

Beneq TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimize any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements.

Beneq TFS 200 represents technical solutions that enable deposition of superior quality coatings on wafers, planar objects, porous bulk materials and complex 3D objects with very high aspect ratio (HAR) features.

Direct and remote plasma-enhanced deposition (PEALD) is available in Beneq TFS 200 as a standard option. The plasma is capacitively-coupled (CCP), which is the industry standard today. The CCP plasma option offers both direct and remote plasma-enhanced ALD (PEALD) for substrates up to 200mm, face-up or face-down.

  • Process cycle time customarily less than 2 seconds. In specific cases even less than 1 second
  • High Aspect Ratio (HAR) available for structures with vias and porous substrates
  • Cold-wall vacuum chamber for rapid heating and cooling
  • Auxiliary entry ports in vacuum chamber enable plasma, in situ diagnostics etc.
  • Load lock available for rapid substrate change and integration with other equipment

 

You can find more information about available options for Beneq TFS 200 on our Options and upgrades page. If you already own a Beneq TFS 200 reactor and want to get an offer for options, please fill in the Beneq TFS 200 option quote form.

Technical Specificatio

Process type
  • thermal ALD
  • plasma enhaced ALD
  • face-up and face-down
Usage
  • R&D
  • production
Substrate type
  • up to 200 mm wafer
  • up to 200 x 200 mm 3D parts
  • powder
Substrate loading
  • automatic
  • manual
Main dimensions
  • 1325 x 600 x 1298 mm
Integration
  • glove box
  • load-lock
  • cluster

 

 Substrate temperature range  25 - 500 °C
 Reaction chamber types and dimensions

 - single wafer:             ø200 × 18 (mm)
 - single wafer plasma:  ø200 × 18 (mm)
 - 3D/batch of wafer:     ø200 × 95 (mm)
 - customized:              by request
 Gas lines  up to 8
 Liquid sources (+5 °C to ambient)  up to 4
 Hot sources HS 300 (ambient to 300 °C)  up to 4
 Hot sources HS 500 (ambient to 500 °C)  up to 2
 Plasma option (PEALD)  - power: 300 W
 - type: capacitively coupled plasma (CCP)
 Fluidized bed particle coating option  - particle size (min.)1: 100 nm - 1 µm
 - sample volume (max.): 50 - 75 cm3
 - temperature (max.)2: 450 °C
 Control system  PLC control with PC user interface
 Main dimensions, ALD system (L × W × H)  1325 × 600 × 1298 (mm)
 Main dimensions, electric cabinet (L × W × H)  1000 × 300 × 1600 (mm)

1 particle property dependent

 

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Application examples

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    Beneq developed a low-temperature ALD moisture barrier solution for a leading supplier of electronics for personal safety monitoring to protect the sensitive circuit board components from moisture.
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    Beneq developed a conformal, dense, and pinhole-free Al2O3 and TiO2 barrier coating for a leading OLED lighting panel manufacturer to protect OLED panels from humidity.
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