Beneq TFS 200

ALD research equipment that grows with you

Beneq TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimize any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements.

Beneq TFS 200 represents technical solutions that enable deposition of superior quality coatings on wafers, planar objects, porous bulk materials and complex 3D objects with very high aspect ratio (HAR) features.

Direct and remote plasma-enhanced deposition (PEALD) is available in Beneq TFS 200 as a standard option. The plasma is capacitively-coupled (CCP), which is the industry standard today. The CCP plasma option offers both direct and remote plasma-enhanced ALD (PEALD) for substrates up to 200mm, face-up or face-down.

  • Process cycle time customarily less than 2 seconds. In specific cases even less than 1 second
  • High Aspect Ratio (HAR) available for structures with vias and porous substrates
  • Cold-wall vacuum chamber for rapid heating and cooling
  • Auxiliary entry ports in vacuum chamber enable plasma, in situ diagnostics etc.
  • Load lock available for rapid substrate change and integration with other equipment.

 

Visit our Research World pages to view our Science Letters and other research performed with Beneq equipment.

You can find more information about available options for Beneq TFS 200 on our Options and upgrades page. If you already own a Beneq TFS 200 reactor and want to get an offer for options, please fill in the Beneq TFS 200 option quote form.

Technical Specificatio

Process type
  • thermal ALD
  • plasma enhaced ALD
  • face-up and face-down
Usage
  • R&D
  • production
Substrate type
  • up to 200 mm wafer
  • up to 200 x 200 mm 3D parts
  • powder
Substrate loading
  • automatic
  • manual
Main dimensions
  • 1325 x 600 x 1298 mm
Integration
  • glove box
  • load-lock
  • cluster

 

 Substrate temperature range  25 - 500 °C
 Reaction chamber types and dimensions

 - single wafer:             ø200 × 18 (mm)
 - single wafer plasma:  ø200 × 18 (mm)
 - 3D/batch of wafer:     ø200 × 95 (mm)
 - customized:              by request
 Gas lines  up to 8
 Liquid sources (+5 °C to ambient)  up to 4
 Hot sources HS 300 (ambient to 300 °C)  up to 4
 Hot sources HS 500 (ambient to 500 °C)  up to 2
 Plasma option (PEALD)  - power: 300 W
 - type: capacitively coupled plasma (CCP)
 Fluidized bed particle coating option  - particle size (min.)1: 100 nm - 1 µm
 - sample volume (max.): 50 - 75 cm3
 - temperature (max.)2: 450 °C
 Control system  PLC control with PC user interface
 Main dimensions, ALD system (L × W × H)  1325 × 600 × 1298 (mm)
 Main dimensions, electric cabinet (L × W × H)  1000 × 300 × 1600 (mm)

1 particle property dependent

 

Contact us to learn more!

Download data sheet [pdf]

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Application examples

  • Backside Passivation for Image Sensors

    The CMOS Image Sensor (CIS) market keeps its momentum with double digit growth. Main and sub cameras for smartphone remain the leading application while automotive image sensors have quickly established themselves as second largest segment. These emerging...
  • Chip-level ALD moisture barrier for components on tape

    Chip-Level Moisture Barrier

      The challenge The device did not pass the highly accelerated stress test (HAST), which tests the device performance after long term high humidity high temperature exposure. The side-walls of the device had to be protected against moisture. The customer...
  • ALD anti-corrosion coating for semiconductor equipment parts

    Anti-Corrosion Coatings for Equipment Parts

      The challenge The fluorine plasma used in semiconductor process equipment causes corrosion in the chamber parts. The existing protective coatings were porous and had particle generation issues inside the wafer processing chamber. The parts are complex...
  • ALD gate dielectric for GaN power devices

    Gate Dielectric for Power Devices

    Wide bandgap (WBG) power semiconductor devices offer very significant energy efficiency gains in a wide range of applications including automotive, transportation, energy, industrial and consumer. WBG semiconductors such as Gallium Nitride (GaN) and...
  • ALD gate insulator for displays

    Gate Insulator for Oxide-TFT Display

      The challenge Use of Oxide Thin Film Transistor (O-TFT) technology in modern display manufacturing requires a highly conformal and pinhole-free gate dielectric with low hydrogen content. Customer had to find an alternative for PECVD, which was not...
  • Ultimate moisture barriers for OLED micro-displays from Beneq

    Encapsulation of OLED microdisplays

    Beneq developed a thin-film encapsulation nanolaminate coating for a leading Asian OLED microdisplay manufacturer to enable long lifetime for their microdisplays.  
  • Lumineq EL40S electroluminescent display by Beneq

    Insulator for thin film EL displays

    An ALD nanolaminate film was developed for Lumineq displays to create a fully pin-hole free thin film insulator layer.
  • Transparent electrode for displays by Beneq ALD

    Top electrode for transparent display

    Beneq developed an ALD Transparent Conductive Oxide (TCO) for Lumineq's electroluminescent displays to replace the sputtered IDO that was used in the transparent top electrode.
  • ALD is the ultimate moisture barrier for PCBs

    Moisture protection of PCBs

    Beneq developed a low-temperature ALD moisture barrier solution for a leading supplier of electronics for personal safety monitoring to protect the sensitive circuit board components from moisture.
  • Beneq FBR ALD reactor for moisture barriers of phospor powder

    Encapsulation of phosphor powder

    Beneq provided a moisture barrier solution using ALD for FBR (fluidized-bed reactor) for a leading phosphor material manufacturer to protect the sensitive phosphor powders used in LED lighting from moisture.
  • Beneq ALD coatings offer protection against corrosion in LED packaging.

    Anti-corrosion coating for LED packaging

    Beneq's ALD coating solution solved a leading LED manufacturer's silver reflector corrosion problem by both applying ALD to coat the semi-finished wire-bonded LED assemblies, and by protecting the silver surface with nSilver.
  • Beneq ALD provides metal-like coatings for watch parts and fine mechanics.

    Metal-like coatings for watch parts

    Beneq developed a thin ALD-based optical coating for a leading watch parts manufacturer to both provide a specific color and to protect from corrosion.
  • Beneq ALD coatings for wafer-level moisture protection

    Wafer-level moisture barrier for LED

    Beneq provided moisture coating using TFS 200 for a leading LED manufacturer to protect LED dies from moisture and prevent oxidation.
  • Beneq ALD coatings provide high-quality reflectors for LED

    Bottom DBR for LED lighting

    Beneq developed a multi-layer DBR structure on a patterned surface for a leading LED manufacturer.
  • Beneq ALD coatings boost the performance of diffractive gratings

    Filling of diffractive gratings

    Beneq used ALD coating to fill diffractive gratings for a leading optical system manufacturer to keep the gratings free from debris and boost their optical performance.
  • Beneq provides ALD coatings to protect electronics components from corrosion

    Anti-corrosion coating for sensors

    The highly conformal and pin-hole free ALD coating solved a leading sensor manufacturer's sensor corrosion problems without compromising sensor sensitivity.
  • ALD coatings provide interface layers between materials in CIGS panels.

    Buffer layer for CIGS solar panel

    Beneq developed a thin, cadmium-free ALD buffer for the solar panels of a leading CGIS solar panel manufacturer.
  • Beneq ALD coatings increase the lifetime of Li-Ion batteries

    Protective coating for Li-ion batteries

    Beneq's ultra-thin ALD coating solved a leading Li-ion battery manufacturer's battery corrosion challenges by reducing the fading of battery capacity caused by repeated charge and unload cycles.

  • Anti-tarnishing coating for jewelry

    Beneq helped Kalevala Jewelry in preventing the discoloration of silver surfaces by providing the patented nSilver industrial-scale protection solution for an ultra-thin, totally conformal, and fully transparent anti-tarnish coating.
  • ALD is ideal for optical filters on complex surfaces.

    Optical NIR filter on a glass cylinder

    Beneq developed a customized batch ALD process for a CCD sensor -based industrial vision systems supplier to coat their near-infrared (NIR) filters.
  • Beneq ALD optical coatings increase the lifetime of high power lasers

    Optical coatings for high power laser lenses

    Benq developed a conformal high- and low-index multilayer optical coating for a leading provider of high power laser optics and coatings using the TFS 500 batch ALD system.
  • ALD-based conformal moisture barrier coatings for microchannel plates from Beneq.

    Coating of Microchannel Plates (MCP)

    Beneq developed an ALD coating solution for microchannel plates (MCP) for Incom, Inc., the world’s largest supplier of rigid fused fiber optics, to allow for significantly greater secondary electron emission .
  • OLED lighting encapsulation with Beneq TFS 600. Fully automated and vacuum-line integrated. For industrial OLED encapsulation.

    Thin-film encapsulation of OLED lighting

    Beneq developed a conformal, dense, and pinhole-free Al2O3 and TiO2 barrier coating for a leading OLED lighting panel manufacturer to protect OLED panels from humidity.
  • X-ray imaging scintillator plate encapsulation with Beneq Coating Services and Beneq P800 batch coating products

    Thin film encapsulation of scintillator plates

    Beneq developed a conformal, dense, and pinhole-free low temperature Al2O3 and TiO2 barrier coating for a leading scintillator plate manufacturer to protect scintillator materials from moisture and increase product lifetime and reliability.

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