In MEMS, the interest for ALD is driven by the unique combination of conformal films deposited at a wide temperature range allowing for a variety of applications. ALD ensures identical film coverage on all sides of the device even at high aspect ratios. The ALD film thickness can be precisely controlled at the atomic level as each reaction cycle deposits approximately one atomic monolayer.
Inkjet nozzle devices comprise a resistive heater element coated with several thick protective layers which interfere with rapid cooling. These protective layers are necessary to protect the heater element from the harsh environment inside inkjet nozzle chambers. In piezoelectric inkjet technology the channels or oscillating material need to be protected against the corrosive effects of all types of inks.
Among the RF MEMS, the SAW and BAW filters convert electrical energy to mechanical acoustic waves and then back to electrical energy and play a key role in the area of signal processing. Consequently, there is significant motivation in improving the piezoelectric coefficient and electromechanical coupling factor of the performance of the piezoelectric material.
For fluid conducting behavior of microcapillary systems containing various 3D microstructures and surface modifying molecular layers. The inner surfaces of the capillary systems are covered by Atomic Layer Deposition (ALD) of different oxide layers to control their wetting properties.
Inertial and Pressure
Sensors, including accelerometers, gyroscopes, pressure sensors, and microphones, have become a multi-billion-dollar market in consumer electronics, automobile, and industrial applications. ALD solutions include anti-stiction hydrophobic films and conformal sealing layers .