Advanced Packaging

For advanced packaging, a low-temperature dielectric ALD film can be deposited on a packaged or unpackaged chip device to coat the device including any exposed electrical contacts. Such a low temperature ALD film can be deposited without damaging the packaged chip device. The ALD film is typically deposited at a sufficient thickness to provide desired qualities such as hermeticity or passivation for the electrical contacts while allowing for electrical connections to be made to the electrical contacts directly through the ALD film without having to release the electrical contacts.