The fluorine plasma used in semiconductor process equipment causes corrosion in the chamber parts. The existing protective coatings were porous and had particle generation issues inside the wafer processing chamber. The parts are complex in shape and larger than usual ALD substrates.
Leading semiconductor equipment manufacturer
A conformal and dense 1µm ALD Al2O3 coating on large chamber parts using the largest ALD batch coater on the market – Beneq P800.