Wafer Fab Equipment
Beneq Transform® 300
The most versatile ALD cluster tool for 300 mm wafer production
EQUIPMENT
Maximum Configuration
3 processing modules & 1 preheater
Preheating capability
Yes
Transfer module
M2C5
Cooling option
Built-in
Substrate loading
EFEM
Substrate size
300mm with 200mm bridge capability
Substrate
Si, Glass, and Others
Dimensions
4400 x 4800 x 2250 mm
Host Integration
SECS/GEM
THROUGHPUT
Al2O3–300°C–50nm
12 wafers/hour – 1 PM
ALD BATCH PROCESS MODULE
Batch size
Up to 25 x 300 mm wafers
Safety standards
SEMI S2 and S8
ALD processes
Al2O3, HfO2, Ta2O5, TiO2, SiO2, ZnO, AlN, TiN
Processing temperature
< 420 °C
Liquid source lines
3+1 (optional)
Ammonia gas line
Optional
Ozone gas line
Optional
Process control
Recipe-based; fully configurable
ALD PLASMA PROCESS MODULE
Single wafer
300mm with 200mm bridge capability
Safety standards
SEMI S2 and S8
ALD processes
AlN, Si3N4, SiO2, Al2O3
Processing temperature
350 °C
Liquid source lines
3+1 (optional)
Plasma gas lines
N2, O2, H2(optional)
Plasma pretreatment
Yes
Ammonia gas line
Optional
Ozone gas line
Optional
Process control
Recipe-based; fully configurable