Tech specs

Reaction chamber

Man with mask

Standard reaction chambers

Reaction chambers RC-200/18 AL and  RC-200/18 SS

  • For single wafers and flat samples
  • Max. substrate dimensions: diam. 200 mm, height 18 mm
  • Optimised for high deposition rate and excellent uniformity
  • Cross-flow precursor delivery
  • Material options aluminum (RC-200/18 AL) , stainless steel (RC-200/18 SS) or titanium
  • RC-200/18 AL recommended max temperature for continuous use 350 °C
  • RC-200/18 SS maximum temperature 500 °C

Reaction chambers RC-200/95 AL and RC-200/95 SS

RC 200/95 AL
  • For wafer batch or 3D samples
  • Diameter 200 mm, height 95 mm
  • Optimised for high deposition rate
  • Cross-flow precursor delivery
  • Maximum wafer diameter 200 mm
  • Customized substrate rack available as option
  • Wafer cassette for 25 wafers available
  • Material options aluminum (RC-200/95 AL) or stainless steel (RC-200/95 SS)
  • RC-200/95 AL recommended max temperature for continuous use 350 °C
  • RC-200/95 SS maximum temperature 500 °C

Wafer casettes for batch reaction chambers

Wafer cassette

WC-100/25, WC-150/25 and WC-200/25

  • For 25 wafer batches (maximum)
  • Used with reaction chamber RC-200/95
  • Material: aluminum
  • Max recommended temperature 350 °C
  • WC-100/25 for 100 mm wafers (diameter)
  • WC-150/25 for 150 mm wafers
  • WC-200/25 for 200 mm wafers

Load lock reaction chambers

LL-RC-200/18 AL and LL-RC-200/18 SS

  • for single round wafers and flat samples with 200 mm wafer adapter
  • maximum substrate diameter 200 mm, height 18 mm
  • optimised for high deposition rate and excellent uniformity
  • cross-flow precursor delivery
  • material aluminum (RC-200/95 AL) or stainless steel (RC-200/95 SS)
  • RC-200/95 AL recommended max temperature for continuous use 350 °C
  • RC-200/95 SS maximum temperature 500 °C

LL-RC-200×200

  • for regtangular single 200 × 200 mm flat glass substrates
  • substrate thickness 1…6 mm (with adapter)
  • excellent for particle sensitive depositions
  • available for face-down processing also!
  • optimised for high deposition rate and excellent uniformity
  • cross-flow precursor delivery
  • material aluminum and stainless steel
  • requires z-axis movement from loader
  • maximum recommended temperature 200 °C

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