High Aspect Ratio (HAR) reaction chamber

For demanding high aspect ratio substrates

Beneq offers a series of reaction chambers specifically designed for coating  demanding high aspect ratio (HAR) substrates. From surfaces with curves and holes to the most demanding HAR imaginable, you can control the precursor dwelling time without limits.

With the HAR chamber option, you get:

• coating inside nanotubes, filters, ceramics and pores
• no cross-contamination
• true stop flow
• different gas flow configuration options
• easy maintenance of reaction chambers

Read more about atomic layer deposition (ALD) for high aspect ratio (HAR) structures.

Or watch a video about Beneq TFS 200 with a HAR option at University of Pardubice.

• coating inside nanotubes, filters, ceramics and pores
• no cross-contamination – the inert gas valve system (IGV) keeps precursor flow out of the reaction chamber
• wide process temperature range – from O °C to 300 °C
• proven performance up to AR of 1:3000
• true stop flow – unlimited precursor residence time
• different gas flow configuration options – cross flows, shower head flows, or both
• easy maintenance of reaction chambers – easy to remove, clean, and put back