The future of moisture protection is here

Seal surfaces with ALD

Atomic layer deposition (ALD) takes moisture protection to a completely new level by providing pin-hole free coating on even the most complex high ratio surfaces.

ALD provides hermetic sealing similar to a metal casing

One of the greatest challenges for power, RF, MEMS, LED and OLED microdisplays is the degradation of performance due to moisture ingress. ALD can help prevent moisture ingress by creating a hermetic sealing similar to a metal casing. ALD is extremely conformal and perfect even for coating high aspect ratio surfaces.

ALD film properties example: 50nm AI203 on Si

Moisture barrier test results presented at CSTIC 2018, Shanghai

Beneq has carried out moisture barrier tests with water vapor transmission rate (WVTR) measurements. The moisture barrier test results will be one of the topics in Mr Sami Sneck’s presentation at the China Semiconductor Technology International Conference (CSTIC) 2018 in Shanghai.

Mr Sneck will also be talking about wafer scale encapsulation with Beneq C2 and much more. if you missed Sami’s presentation titled ALD Moisture Barrier for Wafer Level and Die Level Encapsulation, you can download it by clicking the image below.

Mr Sami Sneck will be talking about ALD Moisture Barrier for Wafer Level and Die Level Encapsulation at CSTIC on Monday, March 12

Drop by our Semicon China stand #2384!

We’ll also be at SEMICON China 2018 on March 14-16, Hall N2, booth #2384 at the Shanghai New International Expo Center. You can book a meeting with us, just fill in the form here.