Beneq Transform®
Versatile, automated ALD solution for high-throughput semiconductor production.
One platform, multiple configurations.
Beneq Transform® establishes a completely new class of ALD cluster tool products in it’s versatility and adaptability to address a broad range of applications and market segments. Beneq Transform® configure with multiple ALD process modules to meet a specific wafer capacity requirement or be later upgraded in response to growing volumes or with new ALD applications.
Thermal and Plasma ALD in one.
Single wafer or batch processing. Widest range of high-performance oxides and nitrides. Maximize your options for flexible volume production. With its flexible automation platform and unique capability to combine both thermal batch and plasma enhanced ALD process modules in one integrated system, Beneq Transform® offers unparalleled flexibility in how processing sequences can be realized to meet the most demanding thin-film deposition requirements.
Designed for the fab.
Industry-standard horizontal wafer loading offers plug-and-play integration. A unique preheating module eliminates waiting time and boosts throughput to a whole new level.
SEMI certified.
Fully compliant with SEMI S2/S8 and SECS/GEM standards. Customized support ensures a smooth transition to ALD in production.
Technical Specifications
| Dimensions | 3000 x 3000 x 2250 mm | Dimensions 3000 x 3000 x 2250 mm |
| Max Batch Load | 200 mm x 25 wafers | Max Batch Load 200 mm x 25 wafers |
| VCE Loadlocks | 2 | VCE Loadlocks 2 |
| Integration | Cluster, up to 3 ALD modules & 1 preheater | Integration Cluster, up to 3 ALD modules & 1 preheater |
| Ozone Process Capability | Optional | Ozone Process Capability Optional |
| Wafer Preheating | – | Wafer Preheating – |
| Wafer Cooling | Built-in | Wafer Cooling Built-in |
| Temperature Range | 25 – 420 ℃ | Temperature Range 25 – 420 ℃ |
| Plasma Gas Lines | 2 + 2 optional | Plasma Gas Lines 2 + 2 optional |
| Transfer Module Type | Mx600 | Transfer Module Type Mx600 |
| Wafer Throughput (Al2O3 @ 200 C, 50 nm) | 40 wafers/hour – 3 PM | Wafer Throughput (Al2O3 @ 200 C, 50 nm) 40 wafers/hour – 3 PM |
| Wafer Throughput (HfO2 @ 250 C, 20 nm) | 28 wafers/hour – 3 PM | Wafer Throughput (HfO2 @ 250 C, 20 nm) 28 wafers/hour – 3 PM |
| Safety and Ergonomics | SEMI S2 and S8 | Safety and Ergonomics SEMI S2 and S8 |
Looking to adopt ALD in your product design and production?
Learn more about Beneq’s Development Service. Visit our FAQ page for expert guidance.
Learn moreSpeak to an expert about Transform®
If you are an existing customer seeking support, upgrades or spare parts, please use our Support form.
