Beneq Prodigy™
The simple and elegant ALD solution for compound semiconductor device fabrication.
The simple and elegant ALD solution for compound semiconductor device fabrication.
Beneq Prodigy™ is the ideal manufacturing solution for VCSEL, LED and MEMS manufacturers and foundries looking to enhance the device performance and reliability through an affordable stand-alone ALD batch tool. Beneq Prodigy provides best-of-breed passivation and/or encapsulation films across multiple wafer types and sizes.
High end technology for a lower price. Prodigy offers a unique breakthrough in economy, capacity and reliability to the compound semiconductor and MEMS manufacturing market.
More time to think about solutions. Prodigy offers pure simplicity through automated loading with horizontal wafer handling and straight-forward maintenance and serviceability with easy side access.
Defining new standards. This tool sets a completely new standard for affordable, high-volume manufacturing of compound semiconductors and MEMS devices with ALD. We use simple automation and reliable reactor design gained at Beneq over 15 years to deliver proven results for high-end application areas.
Beneq Prodigy is cleanroom compatible with SECS/GEM communication capabilities and is compliant with the highest SEMI S2 standards.
Dimensions | 3500 x 2500 mm | Dimensions 3500 x 2500 mm |
Max Batch Load | 150 mm x 50 wafers, 100 mm x 75 wafers | Max Batch Load 150 mm x 50 wafers, 100 mm x 75 wafers |
VCE Loadlocks | 1 | VCE Loadlocks 1 |
Integration | Standalone system | Integration Standalone system |
Ozone Process Capability | Optional | Ozone Process Capability Optional |
Wafer Preheating | – | Wafer Preheating – |
Wafer Cooling | No | Wafer Cooling No |
Temperature Range | 25 – 420 ℃ | Temperature Range 25 – 420 ℃ |
Plasma Gas Lines | 0 | Plasma Gas Lines 0 |
Transfer Module Type | Automatic Loader | Transfer Module Type Automatic Loader |
Wafer Throughput (Al2O3 @ 200 C, 50 nm) | >14 wafers/hour | Wafer Throughput (Al2O3 @ 200 C, 50 nm) >14 wafers/hour |
Wafer Throughput (HfO2 @ 250 C, 20 nm) | N/A | Wafer Throughput (HfO2 @ 250 C, 20 nm) N/A |
Safety and Ergonomics | SEMI S2 | Safety and Ergonomics SEMI S2 |
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