The world’s leading electronic manufacturers work with some of the strictest design constraints to create the most innovative and robust technologies. ALD is the best choice for improving semiconductor-based electronics with the precision needed to engineer nanoscale architecture and enable cutting edge devices.
| Product | Transform®  | Transform ® 300  | Prodigy  |
|---|---|---|---|
| Dimensions | 3000 x 3000 x 2250 mm | 4400 x 4800 x 2250 mm | 3500 x 2500 mm |
| Max Batch Load | 200 mm x 25 wafers | 300 mm x 25 wafers | 150 mm x 50 wafers, 100 mm x 75 wafers |
| VCE Loadlocks | 2 | EFEM | 1 |
| Integration | Cluster, up to 3 ALD modules & 1 pre-heater | SECS/GEM | Standalone system |
| Ozone Process Capability | Optional | Optional | Optional |
| Wafer Pre-Heating | Yes | Yes | Yes |
| Wafer Cooling | Built-in | Built-in | No |
| Temperature Range | 25 – 420 ℃ | 25 – 420 ℃ | 25 – 420 ℃ |
| Plasma Gas Lines | 2 + 2 optional | 3+1 optional | 0 |
| Transfer Module Type | Mx600 | M2C5 | Automatic Loader |
| Wafer Throughput (Al2O3 @ 200 C, 50 nm) | 40 wafers/hour – 3 PM | 12 wafers/hour – 1 PM | >14 wafers/hour |
| Wafer Throughput (HfO2 @ 250 C, 20 nm) | 28 wafers/hour – 3 PM | N/A | N/A |
| Integration | SECS/GEM | SECS/GEM | SECS/GEM |
| Safety and Ergonomics | SEMI S2 and S8 | SEMI S2 and S8 | SEMI S2 |
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