From pilot to volume production – qualified for advanced surface engineering

Beneq Transform® is an ALD cluster tool designed for technology development and manufacturing across power electronics (SiC, GaN, Si), RF, optoelectronics, microLED, MEMS, and sensors. Built for volume production, Beneq Transform scales with throughput and application requirements. It is an ideal platform for applications requiring surface engineering such as surface passivation of wide-band gap materials.

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Versatile platform

Thermal and plasma enhanced ALD (PEALD) in a single tool

  • Combine thermal batch and single-wafer PEALD without breaking vacuum
  • Up to three process modules plus preheating in the same cluster
  • Flexible source configuration for a broad range of oxides, nitrides and nanolaminates
  • Same hardware architecture from R&D to production

 

 

 

Fab-ready by design

Built for throughput, uptime, and seamless fab integration

  • Cycle times down to single-digit seconds for 25-wafer mini-batch processing
  • Preheating module cuts cycle time and enhances productivity
  • Reliable wafer automation with integrated cooling
  • Certified to SEMI S2/S8 and compliant with NFPA 79, Machinery Directive, and UL standards
semiconductors

Application examples

  • Surface passivation of GaN HEMTs
  • Gate oxide for SiC MOSFETs, GaN MISFETs, and vertical GaN devices
  • Surface passivation and etch hardmask for MEMS devices, including RF filters
  • Final passivation of RF and power devices
  • Surface passivation of MicroLEDs and photonics devices
  • Isolation, barrier, and seed layers for TSVs

Not yet moving to volume production?

Introducing Beneq Transform® Lite

Whether supporting low-volume manufacturing or conducting technology development, the Beneq Transform® Lite delivers. It offers the versatility and capabilities of the full Transform platform – at a lower CAPEX investment.

Beneq Transform® Beneq Transform® Lite
Wafer size up to 200 mm up to 200 mm
Max batch Load 25 wafers 25 wafers
Process modules Up to 3 ALD modules + 1 preheating module Up to 2 ALD modules + 1 preheating module
Wafer Cooling Built-in Facet-mounted
Temperature Range Plasma ALD up to 370 °C; thermal batch up to 420 °C Plasma ALD up to 370 °C; thermal batch up to 420 °C
Plasma Gas Lines 2 standard, 2 optional 2 standard, 2 optional
Liquid source lines 4 4
Transfer Module 2 load locks, 4 facets 1 load lock, 3 facets
Host integration SECS/GEM, optional 300 mm extension, optional EDA SECS/GEM, optional 300 mm extension, optional EDA
 
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Cleanroom collaboration stock

Looking to adopt ALD in your product design and production?

Learn more about Beneq’s Development Service. Visit our FAQ page for expert guidance.

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