Cross-flow precursor delivery for excellent thin film uniformity

Beneq reaction chambers support the excellence and modularity of the TFS 200 research platform.

There are two main reaction chamber groups:

  1. Reaction chambers loading through a manual lid
  2. Reaction chambers loading through gate valve (used with a load lock)

Both chamber option groups:

  • Support cross-flow precursor delivery, which guarantees true ALD growth, excellent thin film uniformity and precise precursor dosing
  • Are interchangeable
  • Are easy to assemble
  • Are quick to install
  • Have optimized flow channels for minimal internal volume, high rate deposition and fast purging

Standard reaction chambers

Reaction chambers RC-200/18 AL and  RC-200/18 SS

  • For single wafers and flat samples
  • Max. substrate dimensions: diam. 200 mm, height 18 mm
  • Optimised for high deposition rate and excellent uniformity
  • Cross-flow precursor delivery
  • Material options aluminum (RC-200/18 AL) , stainless steel (RC-200/18 SS) or titanium
  • RC-200/18 AL recommended max temperature for continuous use 350 °C
  • RC-200/18 SS maximum temperature 500 °C

Reaction chambers RC-200/95 AL and RC-200/95 SS

RC 200/95 AL
  • For wafer batch or 3D samples
  • Diameter 200 mm, height 95 mm
  • Optimised for high deposition rate
  • Cross-flow precursor delivery
  • Maximum wafer diameter 200 mm
  • Customized substrate rack available as option
  • Wafer cassette for 25 wafers available
  • Material options aluminum (RC-200/95 AL) or stainless steel (RC-200/95 SS)
  • RC-200/95 AL recommended max temperature for continuous use 350 °C
  • RC-200/95 SS maximum temperature 500 °C

Wafer casettes for batch reaction chambers

Wafer cassette

WC-100/25, WC-150/25 and WC-200/25

  • For 25 wafer batches (maximum)
  • Used with reaction chamber RC-200/95
  • Material: aluminum
  • Max recommended temperature 350 °C
  • WC-100/25 for 100 mm wafers (diameter)
  • WC-150/25 for 150 mm wafers
  • WC-200/25 for 200 mm wafers

Load lock reaction chambers

LL-RC-200/18 AL and LL-RC-200/18 SS

  • for single round wafers and flat samples with 200 mm wafer adapter
  • maximum substrate diameter 200 mm, height 18 mm
  • optimised for high deposition rate and excellent uniformity
  • cross-flow precursor delivery
  • material aluminum (RC-200/95 AL) or stainless steel (RC-200/95 SS)
  • RC-200/95 AL recommended max temperature for continuous use 350 °C
  • RC-200/95 SS maximum temperature 500 °C

LL-RC-200×200

  • for regtangular single 200 × 200 mm flat glass substrates
  • substrate thickness 1…6 mm (with adapter)
  • excellent for particle sensitive depositions
  • available for face-down processing also!
  • optimised for high deposition rate and excellent uniformity
  • cross-flow precursor delivery
  • material aluminum and stainless steel
  • requires z-axis movement from loader
  • maximum recommended temperature 200 °C
Spare Parts

Spare Parts and Upgrades

All Beneq products have been designed with flexibility and usability in mind. With the right options and upgrades you will always have the optimal equipment setup that will grow with you. The right configuration will also help you to decrease your valuable production downtime, maintenance, and repair costs. Below you will find more information about the many options and upgrades available.

Learn more