Beneq TFS 200
ALD research equipment that adapts to your needs.
ALD research equipment that adapts to your needs.
Designed for academic and corporate R&D, the Beneq TFS 200 is a highly versatile atomic layer deposition (ALD) platform, delivering superior film quality in true ALD mode.
The system’s modular architecture allows for a wide range of upgrades, ensuring it can evolve alongside your research requirements, no matter how complex.
The Beneq TFS 200 supports deposition on diverse substrates, including wafers, planar objects, porous materials, and complex 3D structures with high aspect ratio (HAR) features, enabling precise coating in even the most demanding applications.
The Beneq TFS 200 offers direct and remote plasma-enhanced ALD (PEALD) as a standard feature. Utilizing a capacitively-coupled plasma (CCP) source—the industry standard—it facilitates a smooth transition from R&D to production environments. The system supports PEALD processes on substrates up to 200 mm.
Product | TFS 200 | TFS 500 | |
---|---|---|---|
Dimensions (L x W x H) | 1325 mm x 600 mm x 1298 mm | 1800 mm x 900 mm x 2033 mm | |
Chamber volume | 200 x 95 mm (diameter x height) | 200 x 170 mm (diameter x height) | |
Usage | Research, Production | Research, Production | |
Integration | Load lock, cassette loader, cluster or glove box | Load lock, cassette loader, cluster or glove box | |
Temperature Range | 25-500 °C | 25 – 500 °C | |
Very Low Vapor Pressure Precursors | Yes | Yes | |
ALD modes | Thermal ALD, Reduced flow HAR, Fluid bed, Remote plasma ALD, Direct plasma ALD | Thermal ALD, Remote plasma ALD, Direct plasma ALD |
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