Beneq TFS 200

ALD research equipment that adapts to your needs

Designed for academic and corporate R&D, the Beneq TFS 200 is a highly versatile atomic layer deposition (ALD) platform, delivering superior film quality in true ALD mode. 

The system’s modular architecture allows for a wide range of upgrades, ensuring it can evolve alongside your research requirements, no matter how complex. 

The Beneq TFS 200 supports deposition on diverse substrates, including wafers, planar objects, porous materials, and complex 3D structures with high aspect ratio (HAR) features, enabling precise coating in even the most demanding applications. 

Advanced PEALD Capabilities

The Beneq TFS 200 offers direct and remote plasma-enhanced ALD (PEALD) as a standard feature. Utilizing a capacitively-coupled plasma (CCP) source—the industry standard—it facilitates a smooth transition from R&D to production environments. The system supports PEALD processes on substrates up to 200 mm. 

Optimized for Efficiency and Precision

• Pure ALD mode optimized for fast, precise film growth 
• HAR capability for challenging structures such as vias and porous substrates 
• Hot-wall reaction chamber within a cold-wall vacuum chamber for uniform heat distribution and rapid chamber replacement 
• Comprehensive upgrade options to meet advanced research demands 
• Load locks, cassette loaders, and glove boxes for fast substrate transfer under controlled atmospheres
  

The Beneq TFS 200 provides the flexibility, precision, and scalability required for innovative ALD research.