ALD research equipment that adapts to your needs

Designed for academic and corporate R&D, the Beneq TFS 200 is a highly versatile atomic layer deposition (ALD) platform, delivering superior film quality in true ALD mode. 

The system’s modular architecture allows for a wide range of upgrades, ensuring it can evolve alongside your research requirements, no matter how complex. 

The Beneq TFS 200 supports deposition on diverse substrates, including wafers, planar objects, porous materials, and complex 3D structures with high aspect ratio (HAR) features, enabling precise coating in even the most demanding applications. 

Advanced PEALD Capabilities 

The Beneq TFS 200 offers direct and remote plasma-enhanced ALD (PEALD) as a standard feature. Utilizing a capacitively-coupled plasma (CCP) source—the industry standard—it facilitates a smooth transition from R&D to production environments. The system supports PEALD processes on substrates up to 200 mm. 

 

Optimized for Efficiency and Precision 

  • Pure ALD mode optimized for fast, precise film growth 
  • HAR capability for challenging structures such as vias and porous substrates 
  • Hot-wall reaction chamber within a cold-wall vacuum chamber for uniform heat distribution and rapid chamber replacement 
  • Comprehensive upgrade options to meet advanced research demands 
  • Load locks, cassette loaders, and glove boxes for fast substrate transfer under controlled atmospheres 

The Beneq TFS 200 provides the flexibility, precision, and scalability required for innovative ALD research.  

Tech Specifications TFS 200

Product TFS 200 TFS 500
Dimensions (L x W x H) 1325 mm x 600 mm x 1298 mm 1800 mm x 900 mm x 2033 mm
Chamber volume 200 x 95 mm (diameter x height) 200 x 170 mm (diameter x height)
Usage Research, Production Research, Production
Integration Load lock, cassette loader, cluster or glove box Load lock, cassette loader, cluster or glove box
Temperature Range 25-500 °C 25 – 500 °C
Very Low Vapor Pressure Precursors Yes Yes
ALD modes Thermal ALD, Reduced flow HAR, Fluid bed, Remote plasma ALD, Direct plasma ALD Thermal ALD, Remote plasma ALD, Direct plasma ALD
Cleanroom collaboration stock

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