CMOS Image Sensor (CIS) market continues steady growth driven by consumer electronics. Mass market adoption of wafer level optics, advanced 3D integration, and the perennial need for improved sensor responsivity poses demands for thin-film deposition methods, grouped according to functionality, as follows: (A) barrier coating (B) surface passivation and (C) anti-reflection coating.

In this talk Dr Mikko Söderlund of Beneq presents Atomic Layer Deposition as a uniquely qualified solution to meet these demands.