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Beneq Showcases New ALD Systems at Power Electronics Forum in Munich

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On 19 November 2025, Beneq hosted the ALD for Power Electronics Forum in Munich – a focused industry event exploring the rapid evolution of wide-bandgap (WBG) semiconductors and the central role of Atomic Layer Deposition (ALD) in advancing power device performance. 

As SiC and GaN technologies move deeper into automotive, industrial, and renewable energy applications, new materials and architectures are driving the need for more precise, scalable, and reliable interface engineering. The forum addressed these challenges head-on, with expert presentations covering device design, passivation, gate stack formation, and 300 mm platform development. 

ALD at the Center of WBG Innovation

Across all sessions, one theme was clear: ALD is no longer optional – it is critical to the future of WBG power electronics. Its ability to deliver conformal, ultra-thin films with atomic-level precision makes it uniquely suited for complex trench structures, low-defect oxides, and stable dielectric interfaces.

Speakers from PowerAmerica, imec, and Bosch shared insights into their respective R&D and industrialization strategies. Bosch in particular showcased recent results from a joint effort with Beneq to optimize gate formation in dual-channel trench SiC FETs – achieving gains in channel mobility and electrical stability. 

Beneq Introduces Two New ALD Products

Beneq used the forum to unveil two new semiconductor ALD systems, each tailored to different stages of compound semiconductor production: 

  • Beneq Transmute™ – A new spatial ALD platform designed for high-throughput manufacturing of SiC and GaN devices. Transmute combines low-temperature processing with scalable batch architecture, enabling excellent uniformity and productivity across demanding substrates. Read more →
  • Beneq Transform® XP – A next-generation thermal and plasma ALD system featuring a new chamber design for enhanced process control. Transform XP is engineered for R&D and pilot-line environments, supporting fast iteration and advanced process development for emerging WBG device architectures. Read more → 

Shaping the Future of Power Electronics 

The event reinforced the industry’s shared optimism for WBG technologies – and the need for continued innovation in materials and manufacturing. As adoption expands, Beneq remains committed to delivering the ALD platforms that enable the next wave of device performance and reliability. 

Stay tuned for more updates from Beneq –and subscribe to our newsletter at beneq.com to follow the latest in ALD for semiconductors.

 

Beneq Showcases New ALD Systems at Power Electronics Forum in Munich