Wide bandgap power and RF devices demand conformal films, robust dielectrics, and atomic-level engineering across increasingly complex device architectures. Conventional deposition methods often fall short in meeting these requirements at manufacturing scale.

Beneq Transmute™ brings ALD precision to high volume production. Built on Beneq’s proprietary 3-step ALD approach – combining plasma pre-treatment, plasma-enhanced ALD, and thermal batch ALD – it enables stable interfaces and uniform films across varied topographies.

With proven reliability, scalable architecture, and lower cost of ownership, Transmute™ supports the mass production of next-generation power, RF and other specialty devices.