Beneq Transform® XP
ALD Platform for Technology Development and Pilot–to–Volume Manufacturing
ALD Platform for Technology Development and Pilot–to–Volume Manufacturing
Wide bandgap power and RF devices demand atomic-level control over film quality, interface engineering, and material properties. Beneq Transform® XP meets these demands with enhanced ALD capabilities for technology development and pilot-to-volume manufacturing.
Its advanced 25-wafer mini-batch thermal reactor delivers fast, uniform deposition – with sub-10-second cycle times and precise conformality across complex topographies. Plasma-enhanced ALD (PEALD) to precisely manage low-energy ions and optimize pre-cleaning, interface passivation, and tunable device performance.
Transform® XP integrates proprietary in-cycle annealing step that densifies and purifies films, achieving stoichiometric quality and crystallographic alignment. It is the platform of choice for engineering next-generation WBG and RF devices with precision and speed.
Advanced control of low-energy species for optimized pre-cleaning, and tunable PEALD processes – enabling superior surface passivation with best-in-class quality and long-term device reliability.
High-throughput mini-batch reactor with sub-10-second cycles. Precise gas and pressure dynamics for uniform films across complex topography.
In-cycle annealing for densification, purification, and crystallographic alignment. Unlock performance in AlN, Al₂O₃, SiO₂, and beyond.
Whether supporting low-volume manufacturing or conducting technology development, the Beneq Transform® Lite delivers. It offers the versatility and capabilities of the full Transform platform – at a lower CAPEX investment.
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