Hot source HS 300

The hot source HS 300 options support the versatility and modularity of the Beneq TFS 200 research platform in the following ways:

  • enable the use of more precursors and processes
  • are necessary when depositing precursors with low vapour pressure
  • almost all liquid and solid precursors can be used with HS 300 (e.g., HfCl4, ZrCl4, beta-diketonates, amides, cyclopentadienyl, etc.)
  • processes MgO, HfO2, SiO2, Ta2O5, ZrO2
  • high evaporation area as well as load-and-release mode allow lowest possible precursor temperature
  • minimal precursor decomposition

 

  • Large volume container, max. filling 400 ml, with manual input and output valves
  • Three heated zones design

Hot Source HS300

  • for e.g. HfCl4, ZrCl4, beta-diketanotes
  • high evaporation area and load-and-release mode allow using the lowest possible precursor temperature
  • minimal precursor decomposition
  • fast heating
  • optional container particle filtration (patented) system available
  • precursor container must be purchased separately

Hot source for up to 300 °C line temperature for one precursor source container.

Dual Hot Source DHS 300

  • dual sources for two separate HS 300 sources inside a combined frame
  • for e.g. HfCl4, ZrCl4, beta-diketanotes
  • high evaporation area and load-and-release mode allow using the lowest possible precursor temperature
  • minimal precursor decomposition
  • maximum temperature difference is 100 °C between the two sources
  • optional container particle filtration (patented) system available
  • precursor container must be purchased separately

Dual hot source for up to 300 °C for two precursor source containers.

Hot Source Precursor Containers HS 300-PC/OP and HS 300-PC/DOT

  • used with hot source HS 300
  • container volume 580 ml (max. filling rate 400 ml). Use of separate containers for different precursors prevents cross contamination
  • two types of containers available: with removable lid to be filled locally, and all-welded design for safe transportation
  • compatible with HS 300 and DHS 300
  • HS 300-PC/OP: material stainless steel with container and all line parts. Container flange with different CF-gasket materials. Intended to be filled with precursor locally in glove box, removable lid design with metal sealing.
  • HS 300-PC/DOT: material stainless steel. All-welded design with VCR-connections. DOT* certified

 

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Application examples

  • Chip-level ALD moisture barrier for components on tape
  • ALD anti-corrosion coating for semiconductor equipment parts
  • ALD gate dielectric for GaN power devices
  • ALD gate insulator for displays
  • Ultimate moisture barriers for OLED micro-displays from Beneq
  • Lumineq EL40S electroluminescent display by Beneq
  • Transparent electrode for displays by Beneq ALD
  • ALD is the ultimate moisture barrier for PCBs
  • Beneq FBR ALD reactor for moisture barriers of phospor powder
  • Beneq ALD coatings offer protection against corrosion in LED packaging.
  • Beneq ALD provides metal-like coatings for watch parts and fine mechanics.
  • Beneq ALD coatings for wafer-level moisture protection
  • Beneq ALD coatings provide high-quality reflectors for LED
  • Beneq ALD coatings boost the performance of diffractive gratings
  • Beneq provides ALD coatings to protect electronics components from corrosion
  • ALD coatings provide interface layers between materials in CIGS panels.
  • Beneq ALD coatings increase the lifetime of Li-Ion batteries
  • ALD is ideal for optical filters on complex surfaces.
  • Beneq ALD optical coatings increase the lifetime of high power lasers
  • ALD-based conformal moisture barrier coatings for microchannel plates from Beneq.
  • OLED lighting encapsulation with Beneq TFS 600. Fully automated and vacuum-line integrated. For industrial OLED encapsulation.
  • X-ray imaging scintillator plate encapsulation with Beneq Coating Services and Beneq P800 batch coating products

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