Grenoble, France – Beneq, a leading provider of ALD R&D and production technology, today announced the BENEQ TransformTM. A versatile ALD platform it is particularly useful for More-than-Moore device fabrication, OLED and virtual reality applications.
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Bellevue, Washington, USA – Beneq today unveiled R2, a compact modular platform that makes it dramatically easier for universities, research institutes and enterprises to start advanced ALD research. Completely redesigned from the ground up with ergonomics in mind, the basic R2 model comes fully equipped for thermal ALD. With flexible add-on options customers can easily expand to other advanced processes such as plasma, batch processing, powder ALD, and reduced flow.
Scintillates are one of the oldest types of radiation detector because initially measurements could be made with photographic film. Images could be collected, or intensity measurements made. Measurements could even be made with the human eye observing the brightness of frequency of flashes in the scintillator. Nowadays, the light output is converted into data that are processed using compact photodiodes. Scintillators come in different types, and in this edition of the blog, we look at Beneq’s ALD encapsulation solutions.
In this technical blog we describe how ALD can be utilized for coating high curvature optics using spherical domes as an example. The challenge when coating 3D optics is to deposit the coating with high uniformity over an arbitrary topology in a simple manner. ALD has proven its suitability for high precision pinhole free films, where the challenge is not only to achieve uniformity over a large scale, but to coat conformally over high aspect ratio structures.
Proper environmental encapsulation of circuit boards and tin whisker suppression are essential for assuring high reliability of electronics applications in harsh environments. Atomic Layer Deposition offers the best available protection without the drawbacks of parylene coatings.
In industrial applications, and specifically in semiconductor processing equipment applications, damage and failure of metal components results from exposure to reactive chemicals. Atomic layer deposition (ALD) offers qualities that enable the deposition of high-quality anti-corrosion barrier layers.
Atomic Layer Deposition (ALD) is an unmatchable moisture barrier and encapsulation solution for electronics and semiconductor components. The ultra-thin ALD moisture protection can be applied in different phases of the production process: wafer-level, chip-level, package or module-level, and/or Assembled Printed Circuit Board (PCBA) level.
Atomic Layer Deposition (ALD) is truly the ultimate moisture barrier. With ALD, it is possible to create moisture barriers that are thinner and keep humidity and vapors out better than other hermetic packaging options. ALD offers the only way to create conformal ultra-thin protective coatings on surfaces with high aspect ratios and complex 3D shapes. ALD is also a great solution for encapsulating sensitive surfaces.
Reliable, quality maintenance from Beneq Lifecycle Services guarantees you will get the most out of your ALD equipment investment with reduced downtime. Take a look at our maintenance services FAQ.
With an extremely thin ALD coating, you can block moisture effectively and minimize electronic component maintenance.
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