Chip-Level Moisture Barrier
The challenge
The device did not pass the highly accelerated stress test (HAST), which tests the device performance after long term high humidity high temperature exposure. The side-walls of the device had to be protected against moisture.
The customer
A leading power semiconductor device manufacturer
Beneq solution
A conformal ALD Al2O3/TiO2 multilayer moisture barrier was deposited on the die-level with the Beneq P400A high-capacity batch ALD system. A low-temperature process was used to enable coating while the die are on tape.
Related products
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Application examples
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Backside Passivation for Image Sensors
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Chip-Level Moisture Barrier
The challenge The device did not pass the highly accelerated stress test (HAST), which tests the device performance after long term high humidity high temperature exposure. The side-walls of the device had to be protected against moisture. The customer... -
Anti-Corrosion Coatings for Equipment Parts
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