Products

Wafer fab equipment

The Beneq Transform is a new class of ALD cluster tool. It uniquely combines automation with both thermal batch and plasma enhanced ALD process modules. The Beneq Transform offers unparalleled flexibility for processing sequences with multiple ALD process modules to meet wafer capacity. It is designed to be upgradable to meet growing volumes and new ALD processes.


BENEQ Transform™

The BENEQ Transform™ is a one-stop, production-ready ALD solution for power electronics, MEMS and sensors, RF, LED, photonics, and encapsulation applications. It offers both thermal and plasma ALD modules and is capable of single or batch processing. Its proprietary preheating module eliminates hours of waiting time and boosts throughput to a whole new level: 15 wafers per hour @50 nm Al2O3, in thermal mode. Throughput can be further increased by adding up to 2 more process modules, thermal or plasma.

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BENEQ Transform™ Lite

Maximize versatility as volume scales. The BENEQ Transform™ Lite offers the same thermal, plasma and preheating module as the larger Transform™. It works well for R&D, prototyping, as well as volume production. It is capable of surface pre-treatment and can coat substrate materials at wafer sizes from 3 to 8 inches. With the BENEQ Transform™ Lite customers can now run several different ALD processes on multiple devices and applications, all on a single footprint!

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Comparison

Which product is for you

Product Transform™ Lite Transform™ C2R
Dimensions 3000 x 1250 x 2250 mm 3000 x 3000 x 2250 mm 3800 x 1350 x 1950 mm
Max Batch Load 200 mm x 25 wafers 200 mm x 25 wafers 200 mm x 7 wafers
VCE Loadlocks 1 2 2
Integration Cluster, up to 2 ALD modules & 1 pre-heater Cluster, up to 3 ALD modules & 1 pre-heater Cluster, stand alone ALD module
Ozone Process Capability Optional Optional No
Wafer Pre-Heating Yes Yes No
Wafer Cooling Facet-mounted Built-in No
Temperature Range 25 – 420 C 25 – 420 C 25 – 200 C
Plasma Gas Lines 4 4 3
Transfer Module Type Mx400 Mx600 Mx600
Wafer Throughput (Al2O3 @ 200 C, 50 nm) 15 wafers/hour – 1 Process Module 40 wafers/hour – 3 Process Modules 56 wafers/hour
Wafer Throughput (HfO2 @ 250 C, 20 nm) 13 wafers/hour – 1 Process Module 28 wafers/hour – 3 Process Modules process not available
Integration SECS/GEM SECS/GEM SECS/GEM
Safety and Ergonomics SEMI S2 and S8 SEMI S2 and S8 SEMI S2 and S8
Product Transform™ Lite
Dimensions 3000 x 1250 x 2250 mm
Max Batch Load 200 mm x 25 wafers
VCE Loadlocks 1
Integration SECS/GEM
Ozone Process Capability Optional
Wafer Pre-Heating Yes
Wafer Cooling Facet-mounted
Temperature Range 25 – 420 C
Plasma Gas Lines 4
Transfer Module Type Mx400
Wafer Throughput (Al2O3 @ 200 C, 50 nm) 15 wafers/hour – 1 Process Module
Wafer Throughput (HfO2 @ 250 C, 20 nm) 13 wafers/hour – 1 Process Module
Safety and Ergonomics SEMI S2 and S8
Transform™ Lite
Product Transform™
Dimensions 3000 x 3000 x 2250 mm
Max Batch Load 200 mm x 25 wafers
VCE Loadlocks 2
Integration SECS/GEM
Ozone Process Capability Optional
Wafer Pre-Heating Yes
Wafer Cooling Built-in
Temperature Range 25 – 420 C
Plasma Gas Lines 4
Transfer Module Type Mx600
Wafer Throughput (Al2O3 @ 200 C, 50 nm) 40 wafers/hour – 3 Process Modules
Wafer Throughput (HfO2 @ 250 C, 20 nm) 28 wafers/hour – 3 Process Modules
Safety and Ergonomics SEMI S2 and S8
Transform™
Product C2R
Dimensions 3800 x 1350 x 1950 mm
Max Batch Load 200 mm x 7 wafers
VCE Loadlocks 2
Integration SECS/GEM
Ozone Process Capability No
Wafer Pre-Heating No
Wafer Cooling No
Temperature Range 25 – 200 C
Plasma Gas Lines 3
Transfer Module Type Mx600
Wafer Throughput (Al2O3 @ 200 C, 50 nm) 56 wafers/hour
Wafer Throughput (HfO2 @ 250 C, 20 nm) process not available
Safety and Ergonomics SEMI S2 and S8
C2R

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