Research Equipment

TFS500

Thin film system for ALD research and batch production.

1600 × 900 × 1930 mm

Dimensions

R&D, Production

Usage

Glove box, Load-lock, Cluster

Integration

25 – 500 °C

Temperature range

Process type
Thermal ALD
Plasma enhaced ALD
Substrate type
Up to 300 mm wafer
Up to 370 x 470 mm glass
300 x 420 mm batch
3D parts
Powder
Substrate loading
Automatic
Manual
Main dimensions
1600 x 900 x 1930 mm
Integration
Glove box
Load-lock
Cluster
Main dimensions, electric cabinet (L × W × H)
1000 × 300 × 1600 mm
Process temperature range
25 – 500 °C
Reaction chamber types and dimensions
Single wafer: ø200 × 3 (mm) / ø300 × 25 (mm)
Single wafer plasma: ø200 × 3 mm / ø300 × 3 mm
3D/batch of wafers: ø200 × 170 mm
3D/batch: 450 × 300 × 250 mm
Powder: ø80 × 50 mm
Solar cell batch: 156 × 156 mm, 100 pcs
Gas lines
Up to 5
Liquid sources (+5 °C to ambient)
Up tp 4
Hot sources HS 300 (ambient to 300 °C)
Up tp 4
Hot sources HS 500 (ambient to 500 °C)
Up tp 2
Optional
CCP plasma source (capacitively coupled)
Manual load-lock
Control system
PLC control with PC user interface

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