Research Equipment

Beneq TFS200

ALD research equipment that grows with you

1325 x 600 x 1298 mm

Dimensions

Production/R&D

Usage

25 – 500 °C

Substrate temperature range

Up to 8

Gas lines

Process type
Thermal ALD
Plasma enhaced ALD
Face-up and face-down
Usage
Production
R&D
Substrate type
Up to 200 mm wafer
Up to 200 x 200 mm 3D parts
Powder
Substrate loading
Automatic
Manual
Main dimensions
1325 x 600 x 1298 mm
Integration
Glove box
Load-lock
Cluster
Substrate temperature range
25 – 500 °C
Reaction chamber types and dimensions
Single wafer: ø200 × 18 (mm)
Single wafer plasma: ø200 × 18 (mm)
3D/batch of wafer: ø200 × 95 (mm)
Customized: by request
Gas lines
Up to 8
Liquid sources (+5 °C to ambient)
Up tp 4
Hot sources HS 300 (ambient to 300 °C)
Up to 4
Hot sources HS 500 (ambient to 500 °C)
Up tp 2
Plasma option (PEALD)
Power: 300 W
Type: capacitively coupled plasma (CCP)
Fluidized bed particle coating option
Particle size (min.)1: 100 nm – 1 µm
Sample volume (max.): 50 – 75 cm3
Temperature (max.)2: 450 °C
Control system
PLC control with PC user interface
Main dimensions, ALD system (L × W × H)
1325 × 600 × 1298 (mm)
Main dimensions, electric cabinet (L × W × H)
1000 × 300 × 1600 (mm)

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