• Longer product life with ALD moisture barriers

    Wednesday, November 14, 2018

    Atomic Layer Deposition (ALD) is a thin film technology that enables new and highly competitive products. Typical applications of ALD require nanometer-thick, pinholefree, and totally conformal thin films on different shapes and geometries.

    Read more about ultimate moisture protection and the benefits of atomic layer deposition from our new whitepaper.

EXTEND PRODUCT LIFE WITH ALD - DOWNLOAD OUR WHITEPAPER

With ALD, it is possible to create moisture barriers that are thinner and keep humidity and vapors out better than other hermetic packaging options, which makes it a winning moisture barrier for many industries, especially the semiconductor industry. ALD moisture protection can be applied in different phases of the production process: wafer-level, chip-level, package-level, and/or during the final assembly of the Printed Circuit Board (PCB).

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