TFS 600

Thin Film System TFS 600 for industrial OLED encapsulation

The Beneq TFS 600 is an application-specific ALD system designed for vacuum-line integrated organic light-emitting diode (OLED) encapsulation. It provides superior ALD thin-film quality while meeting the high throughput, robustness, and reliability requirements of an industrial in-line environment. In the TFS 600, these requirements are addressed by optimized reaction chamber design, a robust and modular build, proven control and operation components and integrated safety features.

Performance highlights

• Superior thin-film coating quality, ideally suited for demanding OLED encapsulation applications
• Short cycle time meeting high throughput in-line production requirements
• Fully automated loading operations
• Clean-room compatible
• All components located within ventilated frame for occupational safety and health reasons
• Ergonomic design for maximizing efficiency of substrate handling, precursor changing and vacuum chamber access and maintenance
• Control system designed for easy line integration and compatible with GEM/SECS equipment-to-host communication

Technical specifications

Process temperature range	25 - 150 °C, nominal 90 °C
Reaction chamber (L × W × H)	420 × 600 × 1165 (mm)
Substrate	size                  500 × 400 (mm) max. amount    35 pcs (nominal)
Liquid sources (ambient to 90 °C)	up to 5 (may vary)
Control system	PLC control with PC user interface (GEM/SECS compatible)
Main dimensions, ALD system (L × W × H)	2000 × 1200 × 2940 (mm) (may vary)
Main dimensions, precursor rig (L × W)	2200 × 450 (mm) (may vary)

 

More information

Being an application-specific system, more information related to the TFS 600 can be found under the application page for nCLEAR barrier coatings for flexible and organic electronics.

Download TFS 600 brochure (pdf).